Sponsor Name:
National Institute of Standards and Technology (NIST)
Sponsor/Solicitation URL:
Description of the Award:
This NOFO seeks applications for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. Through this NOFO, the NAPMP program seeks to achieve the following objectives:
- Accelerate domestic R&D and innovation in advanced packaging materials and substrates;
- Translate domestic materials and substrate innovation into U.S. manufacturing, such that these technologies are available to U.S. manufacturers and customers, including to significantly benefit U.S. economic and national security;
- Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and
- Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry.
NAPMP plans to release subsequent NOFOs relevant to other research areas and for an Advanced Packaging Piloting Facility (APPF), where successful development efforts will be transitioned and validated for scaled transition to U.S. manufacturing. The APPF is expected to be a key facility for technology transfer to high-volume manufacturing.
Limit (Number of applicants permitted per institution):
1
Sponsor LOI Deadline:
Apr 12, 2024
Sponsor Final Deadline:
Jul 03, 2024
To be considered as a Penn State institutional nominee, please submit a notice of intent by the date provided directly below.
This limited submission is in downselect:
Penn State may only submit a specific number of proposals to this funding opportunity. The number of NOIs received require that an internal competition take place, thus, a downselect process has commenced. No Penn State researchers may apply to this opportunity outside of this downselect process. To apply for this limited submission, please use this link:
Notes:
Madhavan Swaminathan (CoE)